As mobile electronic devices get smaller and smarter, manufacturers of advanced logic semiconductors must produce high-performance, sub-10nm logic chips in ever-increasing quantities. To compete effectively for lucrative advanced logic opportunities, manufacturers must overcome a number of technical challenges.

Key fab challenges:

  • Reduce contact resistance
  • Ensure defect-free epitaxy
  • Minimize particle and metal contamination

Axcelis solution:

We help advanced logic chip manufacturers address these challenges with the industry’s most advanced ion implantation solutions. Our Purion platforms provide:

  • Precise angle control with our exclusive Vector™ Control System
  • Unmatched particulate and metals contamination control
  • Wide temperature range for both hot and cold implant
  • Materials modification capabilities
  • Gallium implant capabilities

Learn about our Purion solutions for High Current, High Energy or Medium Current.