To keep pace with exploding global demand, manufacturers of DRAM and NAND flash memory need to maximize productivity, while maintaining the highest levels of quality, consistency and reliability. Achieving these goals presents daunting challenges for their fab processes.
Key fab challenges:
- Produce high aspect ratio structures
- Maximize junction engineering scaling
- Manage multi-patterning issues
We help memory manufacturers address these challenges with the industry’s most advanced ion implantation solutions. Our Purion platforms provide:
- Precise angle control with our exclusive Vector™ Control System
- Unmatched energy purity with our Eterna™ ELS Source
- Industry-leading particulate and metals contamination control
- Material modification offering the widest range of species
- Damage engineering to maximize quality and productivity
Learn about our Purion solutions for High Current, High Energy or Medium Current.