ION IMPLANTATION

Technology Leadership

Axcelis is recognized around the world as a leader in ion implantation with thirty five years of unprecedented innovation and technology leadership.  We manufacture a complete line of high current, high energy and medium current implanters for semiconductor device manufacturers worldwide. Our implanters support the ever growing global demand for semiconductors by enabling the production of the world's most advanced device technologies.

Keeping pace with your evolving needs

Designed with both existing and emerging applications in mind, our suite of ion implanters includes wafer processing capabilities to cover the entire range of implant applications.  With the broadest energy range of 100eV to 4.5 MeV, our products can most precisely manufacture the most challenging extension implants, to the most exotic halo implant and the deepest wells. We design our products specifically to deliver the highest productivity, with maximum flexibility, and exceptional process control.

The Spot Beam Advantage

Axcelis spot beam technology, standard on all Axcelis tools, is the most precise and reliable approach to perform single wafer implants. Only Axcelis implanters combine these benefits with the productivity required to support the most technically advanced high volume manufacturing demands.

• Highest Productivity: Spot beams are inherently easier to tune and easier to transport, placing the beam where it matters most, on the wafer, which is the key factor contributing to maximum productivity.
• Precision: Device yield depends on the ability to put dopants in exactly the right place, consistently and precisely, and the product line's spot beam delivers the implant precision and repeatability required by the most advanced device technologies.
• Angle Control: All of our implanters utilize state-of–the-art, proprietary angle measurement and correction technology to give the most accurate beam angle measurement and control.
• Superior Uniformity: Combining beam angle control with constant focal length scanning, where the entire wafer sees the same beam and the same beam angle, results in best-in-class implant uniformity and repeatability for all Axcelis implanters.