While many suppliers have de-emphasized their 200mm and below products, Axcelis maintains the RapidStrip 210 for customers in the MEMs, LED, and wafer level packaging markets. This single-chamber system features a current generation controls architecture and shares many subsystems with Axcelis 300mm systems.
Axcelis is a recognized leader in FEOL and BEOL plasma cleaning and dry strip technology. Our systems are known worldwide for providing innovative process solutions, exceptional reliability and low cost of ownership. When it comes to cleaning and dry strip technology, each technology node brings new challenges for process engineers to overcome. New materials, device architectures, and plasma cleaning applications require a diverse set of process capabilities. That's why Axcelis offers several products to address the full range of your application requirements.
Axcelis' innovative advanced cleaning/dry strip product line is the newest generation plasma dry strip platform designed to address next generation device manufacturing down to the 22nm node and below. The platform delivers the most advanced non-oxidizing strip capabilities on the market today for next generation logic and memory devices. Built on the production-proven Integra platform, the Integra ES is the only system designed to run advanced processes effectively and efficiently in a high volume manufacturing environment.
Axcelis' medium current implant product line gives customers the flexibility, precision and productivity for the widest array of low energy, mid dose applications, especially well, channel and HALO processes. The platform utilizes a patented angular energy filter, providing an exceptionally pure beam to ensure maximum performance while eliminating all forms of energy contamination.
Axcelis Technologies sets the standard for innovation in high energy implant technology, with the world's largest installed base and leading market share. The product line, including the Optima XE Series of single wafer systems as well as the Paradigm Series of multi wafer systems, delivers the industry's highest productivity, superior reliability and lowest total cost for high volume production. Together, they are the only complete high energy solution capable of addressing all traditional and emerging high energy application requirements.
Axcelis' high current implant product line covers the entire spectrum of high dose ion implant applications. The Optima HDx is designed to provide you the highest level of productivity with the lowest cost of ownership. In addition, it is designed to provide maximum process versatility and extendibility to future technology nodes, to optimize the return on your equipment investment.
Axcelis offers three configurations of the RapidCure system, including the RapidCure CE, RapidCure FC and RapidCure PS, to give customers the flexibility to cover a broad range of charge erase, film curing and photostabilization applications.
The Summit XT is a single-wafer, hot-wall rapid thermal processing system that delivers inherently uniform, stable processing from <300°C to 1200°C. The system covers a broad range of advanced thermal processing needs for transistor formation in and beyond the 65nm technology node, including anneals for: ultra shallow junction formation, dry oxidation, nickel silicide, shallow trench isolation (STI) oxides and titanium nitride (TiN) densification.