Uniform, Repeatable Thermal Processing
Axcelis' Summit XT covers a broad range of advanced thermal processing needs for transistor formation in and beyond the 65nm technology node, including anneals for:

  • Ultra shallow junction formation
  • Dry oxidation
  • Nickel silicide
  • Shallow trench isolation (STI) oxides
  • Titanium nitride (TiN) densification

    • The Summit XT is a single-wafer, hot-wall rapid thermal processing system that delivers inherently uniform, stable processing from <300°C to 1200°C.

    • Hot-wall enabled process control. Hot-wall design combined with a patented temperature measurement system ensures exceptional long-term repeatability.
    • Improves yield. Large area furnace-based heat source minimizes pattern driven within die non-uniformity that can drive down yield on advanced SOC designs.
    • Benchmark reliability. Simple design delivers unmatched in-fab availability and process stability.
    • Designed for productivity. With a throughput of 105 wafers per hour, the system maximizes productivity and lowers cost of ownership.

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