PLASMA CLEANING FOR SMALL SUBSTRATES
While many suppliers have de-emphasized their 200mm and below products, Axcelis maintains the RapidStrip 210 for customers in the MEMs, LED, and wafer level packaging markets. This single-chamber system features a current generation controls architecture and shares many subsystems with Axcelis 300mm systems.
The RapidStrip 210 offers the most cost effective means of adding incremental capacity to your fab on a modern, production proven platform. The system is capable of processing 75mm to 200mm substrates, and features the innovative RapidStrip downstream microwave plasma source and process chamber technology. RapidStrip 210 uses advanced system control software to provide exceptional level of productivity and reliability.
Oxygen-Free Plasma Descum Process for Photosensitive Cyclotene™ Polymer for Wafer-Level Chip Scale Packaging
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