Two platforms, complete coverage
When it comes to dry strip technology, process application needs are as diverse as our customers. That's why Axcelis offers two distinct product families that address the full range of FEOL and BEOL resist strip and polymer removal requirements for transistor formation, interconnect, and packaging applications through the 45nm technology node.
- Speed, efficiency and economy
Our family of RapidStrip(TM) systems address, high-volume photoresist strip needs, wherereliability and low cost of ownership are premium concerns.
- Process performance and versatility
Our family of RadiantStrip(TM) systems support the most demanding dry strip requirements, including cleaning over advanced low-k dielectric materials.
Recognized dry strip leadership
Our talented team of scientists and engineers has developed proven, select process recipes to remove photoresist and post-etch polymers from silicon wafers. And we continue to develop new stripping and cleaning technologies, ensuring our customers always have the right product for the job at hand.