The RapidStrip 320 dual-chamber, dry strip system provides reliable and repeatable 300mm resist strip processing at the lowest capital and operating cost. RapidStrip tools are qualified for production on technology nodes down to 28nm.
- Fast, effective cleaning. Axcelis' downstream microwave plasma generator and chuck-based wafer heating ensure complete and uniform photoresist removal, wafer after wafer, with monitoring in real time.
- Precise Process Uniformity. Small, independent chambers enable the fastest ash rates while allowing for high chamber matching tolerance and optimized recipes on individual chambers.
- Lowest Overall Cost. Compact design, providing the smallest footprint in the industry, with no chiller or power distribution modules, saves fab space and minimizes operating, facilities and capital costs.
- Highest Dual-Chamber Throughput. Efficient wafer handling, combined with Axcelis' advanced system control software, achieves exceptional throughput and reliability.
Cleaning Challenges and Approaches of Advanced Strip Technologies for the 32nm Node and Beyond
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