The Integra ES is the newest generation plasma dry strip system designed to address next generation device manufacturing down to the 22nm node and below. The system delivers the most advanced non-oxidizing strip capabilities on the market today for next generation logic and memory devices.
- A New Benchmark for Advanced Wafer Cleaning. Never before has there been such a powerful combination of truly enabling technology combined with a production proven, high productivity platform. The system was designed to address the advanced processes and materials challenges at 22nm, effectively and efficiently.
- O2 Free Environment for Advanced Materials. The system features a unique design that has the ability to process wafers with novel, non-oxidizing chemistries, and an innovative load-lock to cool wafers in an inert environment to minimize oxidation; critical for shallow source/drains, high k/metal gates and ultra thin metal applications.
- Widest Applications Space. The Integra ES features the widest application space for O2-free chemistries, enabling the optimization and repeatability of key process parameters, including high dose implant resist residue removal, ashing rate, ashing uniformity, and defect control.
- High Productivity, High Volume. Built on the production-proven Integra platform, the new Integra ES is the only system designed to run advanced processes effectively and efficiently in a high volume manufacturing environment. Its innovative multi chamber design allows unprecedented manufacturing flexibility and speed.