It has been a strong year for the 200mm implant market as growth in
mobile applications and the Internet of Things drive demand for more capable
and cost effective devices. Many
fabs are at capacity, and in search of upgrades that bring added productivity
and performance. The solutions below deliver customer inspired upgrades for long
term value. Our goal is to increase implanter productivity, precision and
capability with the aim of reduced cost of ownership.
by Dr. Leonard Rubin, Chief Device Scientist Axcelis Technologies, Inc.
FinFET devices were introduced in 2011 to replace planar field effect transistor (FET) devices beginning at the 22nm node (Figure 1) . Following this, all core logic transistors were converted from planar to a FinFET architecture by the 16nm node in 2014 [2-4]. In its simplest form, a digital logic transistor acts as a switch. The current flow between the source and drain terminals is either high or low depending on the controlling voltage applied to the gate.
by Tseh-Jen Hsieh and Neil Colvin Axcelis Technologies, Inc., Beverly, MA
It has been shown  that the common
fluoride compounds such as GeF4 and SiF4 used for
pre-amorphization (PAI) species and BF3 as a source gas for B11
and BF2 P-type dopant create problems not only for ion source
operation but also impact device performance.
By J. DeLuca, S. Satoh, H. Chen, T. Fox, S. Kondratenko and R. Reece Axcelis Technologies, Inc.
Many IC and CIS manufacturers still rely heavily on batch high energy ion implanters such as the Axcelis HE3 and Paradigm XE systems. Angle control continues to become increasingly important with the scaling of devices and the increasing use of channeled implants to reduce the number of implant steps needed to produce a box-like dopant profile.
By: Shu Satoh, Chief Scientist Axcelis Technologies
Among many semiconductor manufacturing processes, ion
implantation seems to be the only process which does not benefit from the round
shape of the wafer. For many other
processes, like anneal, etch, CVD, spin coating, CMP in device manufacturing
and lapping and polishing in wafer fabrication, it is a real blessing that
wafers are round.
Many customers are surprised to learn that Axcelis offers more than 1,000 upgrades for its large installed base of 150mm, 200mm, and 300mm high current and high energy batch implanters. We’ve always been committed to delivering long term value to our customers, and a key part of our commitment is to develop evolutionary products that allow for the continuous improvement of your Axcelis installed base.